The TGSB Scholarship Award is established with the objective of offering scholarships to Malaysian students who are thinking of pursuing their first degrees in selected Taiwan universities.

It should be noted that:

1. The successful applicant must enter into a scholarship agreement with Top Glove Sdn. Bhd. ("the Company”).
2. Each individual applicant is responsible for all costs incurred in the course of applying for the scholarship.
3. The Company reserves the right to make changes to these Terms and Conditions without prior notice at any time and/or the right to cancel, modify, suspend, delay or withdraw its offer of the scholarship programme at its sole and absolute discretion and the applicant(s) will be bound by such changes.
4. Only short-listed applicants will be notified via email and/or phone
5. Successful applicants will be required to work with TOP GLOVE GROUP OF COMPANIES based on the duration of the scholarship upon completion of their studies. For instance, if the scholarship is for 2 years, the applicant is required to work in Top Glove for 2 years.
6. If you wish to apply for release before the commencement of the scholarship bond or to terminate the scholarship bond before the stipulated period, you are required to reimburse to the Company the value of the total scholarship as awarded to you.

Applicant must meet all the below requirements

1. Malaysian students pursuing full-time 1st degree courses in selected Taiwan universities and are in their 3rd or 4th year are eligible to apply for this scholarship. Selected universities are as follows:
   • National Taiwan University
   • National Tsing Hua University
   • National Cheng Kung University
   • National Cheng Chi University (Business studies only);
2. Possess good academic qualifications of a minimum average score of 80 (Engineering study) and 75 (Business study) based on previous year’s result;
3. Active participation in extracurricular or sports activities;
4. Applicants must be in good health and strong physique; and
5. Applicants must not be presently holding other scholarship/loans with bonding period from any other corporation/Scholarship or governmental body.

• Scholarship amounting to RM 20,000 per year for Engineering undergraduate students.
• Scholarship amounting to RM 17, 000 per year for Business undergraduate students.

1. Download and complete the application form.
2. Post the completed form to :
   Scholarship Application
   LEVEL 21, TOP GLOVE TOWER,
   16, PERSIARAN SETIA DAGANG, SETIA ALAM,
   SEKSYEN U13,
   40170 SHAH ALAM, SELANGOR D.E. MALAYSIA.
   Tel: +603-3362 3098
   Fax: +603-3362 3860
   Email : [email protected]
   
   
3. Please take note of the scholarship application timeline. Upon closing of the application window, the scholarship committee will review the applications and shortlist eligible candidates for interviews. There will be application evaluation period and interview before the final list of scholarship recipients are announced.
4. ONLY successful applicants will be notified via email and/or phone call.

Submission Period - February to May

Face to face interview - July

Results - August