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Daikin Malaysia Group Scholarship Program

Deadline

Where to Study

Malaysia

Study Level

Degree

Amount

Full Scholarship

Scholarship details

Overview

Daikin, the world's no. 1 air conditioning company, is offering a scholarship to eligible students who have already gained acceptance into Malaysian Public or Private Universities pursuing their 1st-year degree programme.

Criteria

Applicant must meet all the below requirements

  1. Malaysian
  2. Full-time student
  3. The student is pursuing a Bachelor’s Degree
  4. Already gained acceptance into Malaysia Universities (IPTA/IPTS). Preference will be given to students from IPTA.
  5. Possess good academic result:
    • Students who will enrol into a 1st-year degree program
      • SPM or equivalent – min 6As + pass all subjects. Good results in Mathematics, English, and Bahasa Malaysia.
      • STPM/ Pre-University/ Local Matriculation/ Diploma/ Foundation – min CGPA 3.00 & above.
      • MUET – min Band 4.
    • Students currently pursuing a 1st-year degree program
      • SPM or equivalent – min 6As + pass all subjects. Good results in Mathematics, English, and Bahasa Malaysia.
      • STPM or equivalent – min 2As + pass all subjects.
      • MUET – min Band 4.
      • Min GPA or CGPA 3.00
  6. Actively participated in co-curriculum activities and displayed outstanding leadership qualities
  7. Strong communications skills
  8. Possess a positive attitude
  9. Medically fit
  10. Have not received any other financial aid from any organization
  11. Scholars who are free from any future employment obligations
  12. Students who meet the above criteria (a to k) are welcome to apply. However, preference will be given to students from families with a household income of RM5,000 per month or below.
Preferred Discipline

Bachelor's Degree in:

  • Engineering (preferably in Electrical & Electronics, Mechanical, Mechatronic, Manufacturing)
  • IT
  • Accounting
  • Business/Management
Amount Info

Scholar’s Obligations:

  1. Serves a bond with a company offering the scholarship for a minimum of duration sponsor.
  2. The bond will start immediately upon completion of a degree course with the appointment letter given within 3 months period.
  3. The scholar will be required to work in the sponsor company or any subsidiary companies within Daikin Malaysia Group.
  4. Perform internship in the sponsor company or at any subsidiary within Daikin Malaysia Group during semester break.
  5. The scholar shall reimburse 100% of the scholarship fees should he/she resign from the company or is terminated during the period of the bond.

How to apply for Daikin Malaysia Group Scholarship Program

Learn how you can apply now
Click here for application form
  • The application form can be downloaded by clicking on the link above.
  • Applications are open for submission now and close on 11th August 2019.
  • For any further enquiries, please contact Ms. Kay Lee Yen Hui (603-6145 8632) or Mr. Chan Foo Keat (603-6145 8633).
  • Applicants shall submit their application through softcopy or hardcopy.

(Softcopy): Submit to [email protected] with all documents attached in PDF format.

(Hardcopy): Send the complete document to the following address:

Attention: Ms. Kay Lee Yen Hui / Mr. Chan Foo Keat
(Human Resources Department)
DAIKIN MALAYSIA SDN. BHD.
Lot 60334, Persiaran Bukit Rahman Putra 3,
Taman Perindustrian Bukit Rahman Putra,
47000 Sungai Buloh, Selangor D.E. Malaysia.

Selection

  • Only shortlisted scholars will be called for interview. The shortlisted candidates will be notified 2 weeks after the application deadline.
  • The final selection will be based on interview results.

The following applications will not be processed:

  • Incomplete submission of documents.
  • Scholars (students) who do not meet the criteria in para (1).
  • Application received after the deadline.
Contact Info

For more information, please contact:

Phone:
60361458632

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