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Loh & Loh Corp Bhd Scholarship Programme

Deadline

Where to Study

NA

Study Level

Amount

N/A

Scholarship details

Overview

The scholarship aims to support and provide educational opportunities for deserving and outstanding young Malaysians. It also hopes to provide graduate-employability and serve as a talent supply chain for developing young leaders for the Group. 

Criteria

Applicant must meet all the below requirements


  • Open to financially needy and academically inclined Malaysian students including children of employees who are currently pursuing or intend to pursue a full-time first degree in local public/private universities. Scholarship is only applicable for bachelor's degree courses. 

  • Malaysian citizen aged 23 years and below. 

  • Applicants currently waiting for admission or already admitted to pursue a full-time Bachelor’s degree in local public / private university. The public / private university must have been established under the Universities and University Colleges Act 1971 (Act 30), Universiti Teknologi MARA Act 1976 (Act 173) or the Private Higher Educational Institutions Act 1966 (Act 555). 

  • Applicants currently in their 1st, 2nd or 3rd year of undergraduate studies may also apply. 

  • Applicants must achieve the following pre-university qualifications: 

  • SPM minimum 5As, or STPM minimum 2As + 3Bs, or Matriculation / Diploma / A-Levels minimum CGPA 3.33

  •  Current 1st, 2nd or 3rd year university students : minimum CGPA 3.33

  • Applicants with outstanding extra-curricular record will have added advantage. 

  • Family (parents or guardians) household income not exceeding RM5,000 per month. 

  • Currently not a recipient of any scholarship, loan of financial aid from any other organizations. 

Preferred Discipline

  • Built environment (quantity surveying, land surveying, building & construction management)

  • Engineering (civil & structural)

  • Any course related to the above

Amount Info
  • Full tuition fees and living expenses for successful applicants amount to RM15,000 per academic year or RM60,000 for full degree course
  • Must serve a 3-year bond with the company upon graduation
  • Must achieve and maintain a minimum CGPA of 3.33 or equivalent per academic year during the scholarship programme. 

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